体积小,适合高密度表面贴装
Small Size For SMT.
采用端电极结构,很好地抑制了引线引起的寄生元件效应,具有高可靠性
Using Terminal Electrode Structure To Restrain The Parasitic Component Effect Quite Caused By Lead.
比常规UF/IF系列产品更低电阻、更高电流和更高电感量
Lower Resistance, Higher Current, And Higher Inductance Than Conventional UF/IF Series Products.
优良的焊接性和耐焊性
Execellent In Solder Ability And Heat Resistance.

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